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LZ0P3817
LZ0P3817
DESCRIPTION
The LZ0P3817 is a 1/4-type (4.5 mm) 350 000pixel built-in lens color CMOS (Complementary Metal Oxide Semiconductor) image sensor that consists of a timing generator (TG), a correlated double sampling (CDS) circuit, an auto gain control (AGC) circuit and an analog-to-digital converter (ADC) circuit. With small lens and LCC-type flat package, possible to make ultra small color camera easily.
1/4-type Built-in Lens Color CMOS Image Sensor with 350 k Pixels
PIN CONNECTIONS
36-PIN LCC TYPE
REFIN SIGOUT
TOP VIEW
SIGIN
BIAS2
LOAD 29
36
NC
35
34
33
32
31
30
BIAS1 AGCOUT AGND AVDD OFS ADL ADH NC STBY
1 2 3 4 5 6 7 8 9
Y
14 15 16 17 CKI CKO D0 D1 D2 18
28
SCLK 27 26 25 24 23 22 21 20 19
CLP1
CLP2
SDI VD HD CLK D7 D6 D5 D4 D3
FEATURES
* * * * * Progressive scan Square pixel Compatible with VGA standard Number of image pixels : 655 (H) x 493 (V) Number of optical black pixels - Horizontal : 24 front and 24 rear - Vertical : 3 front and 3 rear Pixel pitch : 5.6 m (H) x 5.6 m (V) R, G, and B primary color mosaic filters Image inversion function (horizontally and/or vertically) Available for two types of power save mode - AGC and AD circuits become power-off with serial data - All circuits become power-off with STBY pin Monitoring mode Analog output and 8-bit digital output Variable gain control (3 to 30 dB) Variable electronic focal plane shutter (1/15 to 1/7 875 s) Single +2.8 V power supply Built-in IR cut-off filter Integrated lens : 62 horizontal viewing angle Package - 36-pin LCC* type - Outline dimensions : 11.4 mm (H) x 11.4 mm (V) - Height : Approx. 7 mm
IN
1
10
11 AVDD
12 DGNG
A
AGND DVDD 13
* * * *
IM
PRECAUTIONS
* Refer to "PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS".
* * * *
P
R
* * * *
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
E
L
* Leadless Chip Carrier
R
LZ0P3817
BLOCK DIAGRAM
HD, VD CLK DATA TG AGC CONTROL 8-BIT D/A
ANALOG VIDEO OUTPUT
P
R
E
L
IM
IN
2
AGC OUTPUT
A
CMOS IMAGE SENSOR
AGC
R
8-BIT A/D
Y
DIGITAL VIDEO OUTPUT
LZ0P3817
PIN DESCRIPTION
PIN NO. SYMBOL 1 BIAS1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 AGCOUT AGND AVDD OFS ADL ADH NC STBY AGND AVDD DGND DVDD CKI CKO D0 D1 D2 D3 D4 D5 D6 D7 CLK HD VD SDI SCLK LOAD CLP2 CLP1 I/O - O - - - - - - I - - - - I O O O O O O O O O O I I I I I A/D Analog Analog Analog Analog Analog Analog Analog - Digital Analog Analog Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital Digital DESCRIPTION Analog bias voltage 1 for image sensor AGC output Analog ground Analog power supply Offset bias voltage for AGC output Bottom ADC reference voltage Top ADC reference voltage No connection Standby control mode* Analog ground Analog power supply Digital ground Digital power supply Clock input for oscillator (12.27 MHz) Clock output for oscillator ADC signal output ADC signal output ADC signal output ADC signal output ADC signal output ADC signal output
ADC signal output (MSB) Clock output (6.135 MHz) Horizontal drive pulse input Vertical drive pulse input Control data input (AGC gain, offset, shutter control,
E
R
Digital Digital
- - I -
Analog Analog Analog Analog Analog Analog -
P
SIGOUT
O
SIGIN BIAS2
35 36
REFIN NC
I -
* Standby mode functions High level : Standby mode (all circuits power-off), Low level or open : Normal mode (all circuits active)
L
image inversion, etc.) Shift clock for data Load pulse for data input Analog bias voltage 2 for clamp circuit Analog bias voltage 1 for clamp circuit Analog image signal output Analog image signal input Analog bias voltage 2 for image sensor Reference voltage for analog input No connection
IM
3
IN
ADC signal output (LSB)
A
R
Y
LZ0P3817
ABSOLUTE MAXIMUM RATINGS
PARAMETER Power supply voltage Input signal voltage Storage temperature SYMBOL VDD VO TSTG RATING -0.3 to +4.6 -0.3 to VDD + 0.3 -20 to +70 UNIT V V C
RECOMMENDED OPERATING CONDITIONS
PARAMETER Power supply voltage Operating temperature Oscillation frequency Digital input voltage Analog input voltage Analog bias voltage Normal mode Monitoring mode LOW level HIGH level SYMBOL VDD TOPR FCK VOL VOH 0 0.8VDD (Connect to pin through a capacitor) (Connect to GND MIN. 2.6 -20 TYP. 2.8 +25 12.27 0.2VDD VDD MAX. 3.0 +50 UNIT V C MHz V V 1 2 3 NOTE
NOTES :
P
R
E
L
IM
4
1. Applied to input pins STBY, HD, VD, SDI, SCLK and LOAD. 2. Applied to input pins SIGIN and REFIN. Do not connect to DC directly. 3. Applied to pins BIAS1, BIAS2, OFS, ADL, ADH, CLP1 and CLP2. Do not connect to GND directly.
IN
through a capacitor)
A
R
Y
LZ0P3817
CHARACTERISTICS (1/15 s progressive scan readout mode)
(TA : +25C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS". Color temperature of light source : 3 200 K) * Measurement point : Analog image signal output (pin No.32), before AGC circuit and AD converter.
PARAMETER Standard output voltage Saturation output voltage Dark output voltage Sensitivity (Green channel) Vertical line fixed pattern noise Resolution (at center) Resolution (at corner) Shading Difference of center position Standby current Supply current ISTBY IVDD SYMBOL VO VSAT VDARK R (G) VFPN 300 150 20 1 13 150 MIN. 400 TYP. 150 700 2 250 0.5 350 200 10 10 1.1 MAX. UNIT mV mV mV mV NOTE 1 2 3 4 5 6 7 8 9 10 11
3
R
A
NOTES :
1. The average output voltage of G signal in the central area (H/10, V/10) under uniform illumination. The standard exposure conditions are defined as when VO is 150 mV. 2. The average output voltage of G signal in the central area (H/10, V/10) under 10 times exposure of the standard exposure conditions. 3. The difference between average output voltage of the image area and that of the OB area, under nonexposure conditions. 4. The average output voltage of G signal in the central area (H/10, V/10) when a 500 lux light source with a 90% reflector is imaged. 5. One mean horizontal line signal is obtained by adding all the horizontal line signals vertically and dividing them by the line number. is the deviation of the center pixel from the average of successive 5 pixels in . VFPN is the maximum absolute value of .
P
6. The resolution in the central area (H/10, V/10) at which the image of the TV resolution chart (ex. EIAJ test chart) can be distinguished on the B/W video monitor when converted into composite video signal. 7. The resolution in the peripheral area (image height : Y = 0.7) under the conditions mentioned above. 8. Defined by the following formula at the brightness of standard output voltage of G signal : (Vco/Vce) x 100 [%] Vco : Output voltage at edge (image height : Y = 0.7) of the image. Vce : Output voltage at center of the image. 9. The difference between the center position of image and that of the monitor. This is the ratio for the horizontal underscanning monitor size which includes the decentering eccentricity when turning the lens head one time. 10. Total current of power supply in standby mode. (Pin No.9 (STBY) is fixed to "H" level and other input pins are fixed to "H" level or "L" level.) 11. Total current of analog and digital power supplies, in the dark and at the standard load conditions.
R
E
L
IM
5
IN
Y
TV line TV line % % mA mA
mVp-p
LZ0P3817
LENS SPECIFICATIONS
PARAMETER Construction Focal length F No. Viewing angle TV distortion Focus adjustment range Torque of focusing SPECIFICATION Single (non-spherical, plastic) 3.1 mm5% [reference] 2.85% H : 62, V : 50, Diagonal : 75 [TYP. : reference] -5% to 10 cm 0.0005 to 0.01 N*m 1 2 3 4 NOTE
y y
P
R
E
L
IM
6
IN
A
1. Image area : 3.67 mm (H) x 2.76 mm (V) 2. TV distortion is defined by the formula, (y/y) x 100 [%] at capturing rectangular pattern sized horizontal by vertical as 4 by 3. "y" is defined as the vertical height of center of the horizontal line. "y" is defined as the difference between the vertical height of the center of the horizontal line and edge of it.
* Be careful not to remove the lens head by turning it counterclockwise too much when adjusting macro.
R
3. The best focus point of an object can be obtained by turning the lens head within this range. 4. Torques which are necessary for turning the lens.
Y
NOTES :
LZ0P3817
PIXEL STRUCTURE
OPTICAL BLACK (3 PIXELS)
OPTICAL BLACK (24 PIXELS) 655 (H) x 493 (V)
OPTICAL BLACK (24 PIXELS)
1 pin
OPTICAL BLACK (3 PIXELS)
(1, 493)
IN
R G B G B G B R G R G R G G R G R G G R G R G R B G B G B G G R G R G R
COLOR FILTER ARRAY
R G R G R G G B G B G B R G R G B R G R
A
(655, 493)
G B G B G B
IM
G B G R G R G G B G G R G R G R B G B G B G G R G R G R
L
E
R
G R G R G R
B G B G B G
B G B G B G
P
(1, 1)
7
R
R G R G R G G R G R G R
(655, 1)
Y
LZ0P3817
TIMING CHART
[Normal Mode]
HORIZONTAL PULSE TIMING
HD 776 780 012 4 CLK ADOUT (D0-D7)
Normal
8
12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 88 92
645 650 655OBOB
Mirror
10 HD CLK ADOUT (D0-D7)
Normal
5
1 OBOB
74 78 82 86 90 94 98 102 106 110 114 118 122 126 130 134 138 142 146 150 154 158 162 166 170
OB OB 1
Mirror
5
10
15
R
20 25 30
OB OB655 650 645 640 635 630 625
* The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1). * The falling edge of the HD pulse must be between two rising edges of CLK (78) and CLK (79).
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK)
CLK t ADOUT (D0-D7)
IN
SYMBOL t MIN.
Shutter D20
A
45
TYP. MAX. UNIT ns
IM
Offset D10
VERTICAL PULSE TIMING
SDI, SCLK, LOAD Forbidden Period
VD HD ADOUT (D0-D7)
Normal
523 524 525 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
492 493 OB OB OB
Mirror
L
OB OB OB 1 2 3 4 5 6 7 OB OB OB 493 492 491 490 489 488 487
2 1 OB OB OB
* The rising edge and falling edge of the VD pulse must be in high period of the HD pulses.
R
P
D0
E
SERIAL DATA TIMING (SDI, SCLK, LOAD)
Fixed Gain
AGC
D30
SDI
SCLK LOAD
* Data in SDI are taken at the rising edge of SCLK. * Clock frequency of SCLK should be less than 1/2 of that of CLK. * Do not insert the SDI, SCLK and LOAD pulses between 28H* and 29H*. Refer to "VERTICAL PULSE TIMING". * Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D37. * It means ordinal number of the HD pulse.
8
Y
35 40 620 615 D37
LZ0P3817
[Monitoring Mode]
HORIZONTAL PULSE TIMING
HD 776 780 012 4 CLK ADOUT (D0-D7)
Normal
8
12 16 20 24 28 32 36 40 44 48 52 56 60 64 68 72 76 80 84 88 92
645 650 655OB OB
Mirror
10 HD CLK ADOUT (D0-D7)
Normal
5
1 OB OB
74 78 82 86 90 94 98 102 106 110 114 118 122 126 130 134 138 142 146 150 154 158 162 166 170
OB OB 1
Mirror
5
10
15
R
20 25 30
OB OB655 650 645 640 635 630 625
* The rising edge of the HD pulse must be between two rising edges of CLK (0) and CLK (1). * The falling edge of the HD pulse must be between two rising edges of CLK (78) and CLK (79).
PHASE RELATIONS BETWEEN DIGITAL OUTPUT (ADOUT) AND CLOCK (CLK)
CLK t ADOUT (D0-D7)
IN
SYMBOL t MIN.
Shutter D20
A
45
TYP. MAX. UNIT ns
IM
Offset D10
VERTICAL PULSE TIMING
SDI, SCLK, LOAD Forbidden Period
VD HD ADOUT (D0-D7)
Normal
260 261 262 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
486 489 490 493 OB
Mirror
L
OB 1 2 5 6 9 10 13 14 17 18 21 22 25 26 29 30 33 34 37 38 41 42 OB 493 492 489 488 485 484 481 480 477 476 473 472 469 468 465 464 461 460 457 456 453 452
8 5 4 1 OB
* The rising edge and falling edge of the VD pulse must be in high period of the HD pulses.
R
P
D0
E
SERIAL DATA TIMING (SDI, SCLK, LOAD)
Fixed Gain
AGC
D30
SDI
SCLK LOAD
* Data in SDI are taken at the rising edge of SCLK. * Clock frequency of SCLK should be less than 1/2 of that of CLK. * Do not insert the SDI, SCLK and LOAD pulses between 15H* and 16H*. Refer to "VERTICAL PULSE TIMING". * Refer to "SERIAL DATA INPUTS" for the contents of serial data from D0 to D37. * It means ordinal number of the HD pulse.
9
Y
35 40 620 615 D37
LZ0P3817
SERIAL DATA INPUTS
DATA D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 D29 D30 D31 D32 D33 D35 D36 D37 MAX2 (MSB) MAX1 MAX0 (LSB) OFS7 (MSB) OFS6 OFS5 OFS4 OFS3 OFS2 OFS1 OFS0 (LSB) SHT9 (MSB) SHT8 SHT7 SHT6 SHT5 SHT4 SHT3 SHT2 SHT1 SHT0 (LSB) MIRH MIRV MON NAME AGC6 (MSB) AGC5 AGC4 AGC3 AGC2 AGC1 AGC0 (LSB) Selection of fixed gain (3 to 10 dB) Offset level control of ADC (0.9 to 1.5 V) Auto gain control (0 to 20 dB) FUNCTION
Shutter speed control
E
L
R
P
SAD2 (MSB) SAD1 SAD0 (LSB) LPMD1 LPMD0 USB
IM
(Normal mode : Exposure time is 1 to 1/525 frame period.) (Monitoring mode : Exposure time is 1 to 1/262 frame period.)
H : Horizontal mirror inversion image, L : Normal image H : Vertical mirror inversion image, L : Normal image H : Monitoring mode, L : Normal mode Phase selection of AD clock D32/D33/D34 = L/L/L : -30 D32/D33/D34 = L/H/L : 0 Power save mode D35/D36 = L/L : Normal mode D32/D33/D34 = L/L/H : -15 D32/D33/D34 = L/H/H : +15 D35/D36 = L/H : AD and AGC off
D34
D35/D36 = H/L : AD off D35/D36 = H/H : Inhibited mode H : Inhibited mode, L : Normal mode
IN
10
A
R
Y
Not used. (Fix to low level.)
LZ0P3817
Setting of Auto Gain Control
* One LSB of the gain code represents approximately 0.156 dB. * Nominal gain values at typical codes are shown below.
AUTO GAIN CONTROL (dB) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 D0 L L L L L L L L L L H H H H H H H H H H H D1 L L L L L H H H H H L L L L L D2 L L L H H L L L H H L L L H H H L D3 L L H L H L L H L H L L D4 L H H L L L H H L L D5 L H L H L L H L H L L H L H L H H L H L H D6 L L H H H L L
R
L H H L L H H H L L H
A
H L H H L H L H H
IN
L H H H H H L H H H D10 L H L H L H L H
IM
Setting of Fixed Gain
FIXED GAIN (dB) 3 4 5 6 7 8
* One LSB of the gain code represents 1 dB.
E
R
P
9 10
L
D8 L L L L H H H H
D9 L L H H L L H H
11
Y
L H H L L L H H H L L H H H
LZ0P3817
Setting of Offset Level
* One LSB of the offset code represents approximately 0.002 V. * Nominal offset values at typical codes are shown below.
OFFSET LEVEL (V) 0.9 1.0 1.1 1.2 1.3 1.4 1.5 D11 L L L H H H H D12 L L H L L H H D13 L H L L H L H D14 L L H L L H H D15 L H L L H L H D16 L L H L L H H D17 L H L L H L H D18 L H H L L H H
Setting of Shutter Speed
* One LSB of the shutter speed code represents 1H, where 1H is the HD pulse period. * Shutter speed values at typical codes are shown below in normal mode, monitoring mode and USB mode.
SHUTTER SPEED (Exposure Time Unit : H) Normal 525 * * 265 264 263 * * 27 26 25 * * 2 1 525 * * 525 Monitoring 262 * * 2 1 262 * * 262 262 262 * * 262 262 262 * * 262 D19 L D20 L D21 L D22 L D23 L
A
D24 L L L L L L L H H H H H H L L L L L L H H
R
D25 L L L L L L L H H H H
Y
D26 L D27 L H H H L L H L L H H H L L H H H L L H H
D28 L
L
L L L
IM
L L L
H H H
L L L
IN
L L L H H H L L L H
L H L
H H H
H H H
L H L
R
E
H H H
L L L
L L L
H L H
H
H
H
H
Setting of Driving Modes
FUNCTION Normal mode Monitoring mode D31 L H D37 L L
P
12
* Insert capacitors more than 10 F between AVDD and AGND and between DVDD and DGND. * Capacitors whose values are not shown must be 0.1 F.
(6.135 MHz)
P
CLK HD D7 D6 D5 D4 D3 VD SDI 27 18 17 16 15 14 13 12 11 10 DVDD DGND AVDD AGND CKI Digital Power Supply CKO Oscillator (12.27 MHz) D0 D1 D2 26 25 24 23 22 21 20 19 28
R E
29 30 31 32 33 34 35 36 1 NC ADL OFS ADH AVDD BIAS1 AGND AGCOUT 2 3 4 5 6 7 8 9 CLP2 CLP1
SCLK LOAD
L
LZ0P3817
(TOP VIEW)
EXAMPLE OF OPERATION CIRCUIT
SIGOUT SIGIN BIAS2 REFIN NC +
10 F
IM
STBY
13
+ 10 F
IN
A
R
Y
Analog Power Supply
LZ0P3817
LZ0P3817
PACKAGE OUTLINES 36 LCC TYPE
Center of effective imaging area 11.400.1 Center of package 0.70 3-C0.2 11.400.1 P10.800.05
Under development (Unit : mm)
3-O0.600.05
0.650.1
P10.800.05
36-1.27
Index mark
11.200.1
O9.0-0.1 (M7XP0.35)
R0.20
No.1mark
+0
3-R0.300.05
1.20
36-R0.15
32-1.00
O9.00-0.1
Approx.7.0 (INF)
5.700.2
+0.1 0.30-0
0.70
3.000.2
P10.800.05 11.400.1
0.500.1
1.20
1.80
Applicable model LZ0P3817
14
36-0.60
+0
11.400.1
R0.4
11.200.1
O9.00
36-0.30
LZ0P3817
PRECAUTIONS FOR BUILT-IN LENS CMOS IMAGE SENSORS 1. Package Breakage
In order to prevent the package, the lens holder, and the lens from being broken, follow the instructions below : 1) The built-in lens CMOS image sensor is a precise optical component and the packagebase material is ceramic. Therefore, o Take care not to drop the device when mounting, handling, or transporting. o Avoid giving a shock to the package. Especially when pins are fixed to the socket or the circuit board, a small shock could break the package more easily than when the package isn't fixed. 2) If any damage or breakage occurs on the surface of the lens, its characteristics could deteriorate. Therefore, o Do not hit the lens. o Do not give a shock large enough to cause distortion. o Do not scrub or scratch the surface of the lens. - Even a soft cloth or applicator, if dry, could cause flaws to scratch the lens.
3) To avoid generating static electricity, a. do not scrub the lens and package with cloth etc. b. do not attach any tape or labels. 4) When storing or transporting the device, put it in a container of conductive material.
3. Dust and Contamination
Dust or contamination on the surface of the lens and the inside of the lens holder could deteriorate the output characteristics or cause a scar. In order to minimize dust or contamination on the device, take the following precautions : 1) Do not remove the lens from the body. Especially when adjusting macro, be careful not to remove the lens by turning it counterclockwise too much. 2) Do not touch the surface of the lens with the fingers. If dust or contamination gets on the surface of the lens, the following cleaning method is recommended : o Handle the built-in lens CMOS image sensor in a clean environment such as a cleaned booth. (The cleanliness level should be, if possible, class 1 000 at least.) o Dust from static electricity should be blown off with an ionized air blower. For antielectrostatic measures, however, ground all the pins on the device before blowing off the dust. o The contamination on the surface of the lens should be wiped off with a clean applicator soaked in isopropyl alcohol. Wipe slowly and gently in one direction only. - Frequently replace the applicator and do not use the same applicator to clean more than one device. o Make sure there is no dust or contamination on the lens and screw it on the lens holder.
2. Electrostatic Damage
As compared with general MOS-LSI, CMOS image sensor has lower ESD. Therefore, take the following antistatic measures when handling the CMOS image sensor : 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1 M$ between the human body and the ground to be on the safe side. 2) When directly handling the device with the fingers, hold the lens holder and do not touch the pin.
15
LZ0P3817
4. Other
1) Soldering should be manually performed within 1.5 seconds per pin at 400C maximum at the tip of soldering iron. o Use ESD-measured soldering iron o The conditions of the soldering time in which the soldering iron touches the package. - In case where the soldering may exceed 1.5 seconds per pin, resume the work after the device returns to normal temperature. o Do not put too much force onto the lens and the lens holder while soldering. o Be careful not to let the soldering iron touch the lens holder. - Soldering can be quickly/neatly done by laying the soldering iron so it lightly touches the border between the package and the circuit board and sliding it in sideways. 2) There is no guarantee of the performance of the device which has been removed or resoldered after being soldered once under the conditions mentioned above. 3) Avoid using or storing the built-in lens CMOS image sensor at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the built-in lens CMOS image sensor. 4) Do not expose the device to strong light. For the color device, long exposure to strong light will fade the color of the color filters.
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